Scope of this guide
This management guide translates the process into cost, risk and throughput: what to measure, what to audit and where the money leaks.
Process: Die-Casting. Figures in this guide are industry-standard starting ranges; confirm against your supplier TDS before locking settings.
Working ranges and control points
The table below is the daily reference for a die-cast cell. Set by the card, verify by the control point column.
| Parameter | Typical range | Control point | Watch out |
|---|---|---|---|
| Mould temperature | 180–220 °C zinc | Thermocouple per cavity | Cold moulds cold-flake |
| Injection speed | High-speed switch position | Shot profile log | Speed too high traps air |
| Porosity target | No blisters after 200 °C bake | Bake test per lot | Hidden porosity blows in plating |
| Trim die flash | ≤ 0.1 mm remaining | First-article check | Flash lines show after polishing |
| Alloy lot control | One supplier lot per run | Lot tag on tote | Mixed alloys vary plating |
Run It As A Business: the management view
Beyond the basic card, this is the layer that matters at your level:
| Cost line | What drives it | Metric to track | Typical lever |
|---|---|---|---|
| Chemicals | Drag-out and bath dumps | Cost per 1000 parts | Rinse counter-flow, drip bars |
| Rework | First-pass yield losses | FPY by defect family | Fix top family first |
| Energy | Heated tanks and idle time | kWh per 1000 parts | Covers, night setback |
| Claims | Escape rate | PPM by customer | Ship gate on FPY |
Standard routine
- Bake-test first articles before release to plating
- Weigh shots; drift means sleeve wear
- Tag totes by alloy lot
- Check flash at trim, not after packing
- Log cavity temps at start, mid, end
Engineer notes
- Plating bake at 200 °C is the honest porosity test
- Vent plugs wear — rising porosity often means vent maintenance
- Gate marks polish out easier than solder marks; fix die lube first
- Alloy lead content poisons nickel baths — keep lots separate
- Weigh every shot: weight drift predicts porosity
Safety: Molten zinc splash risk at the shot sleeve. Full face shield, no water near the cell, and dry tools only.
FAQ
Why do blisters appear after plating, not before?
Sub-surface porosity expands during plating bake. Bake-test castings before releasing them.
What causes solder on the die?
Die lube failure or local overheat. Re-check release agent coverage at that feature.
How is alloy lot control linked to plating?
Trace elements vary with each lot and change deposit colour and adhesion.
Which single metric should I start reporting weekly?
First-pass yield by defect family; it exposes rework cost and points at the largest lever.